Mazak Optonics HCG-4020 CNC Laser Cutting Machine from China
A numerically controlled laser sawing machine designed for high-precision cutting-off of semiconductor wafers from monocrystalline boules in semiconductor manufacturing. It removes material using a focused laser beam on silicon or gallium arsenide, fitting under HTS 8461.50.40 as a numerically controlled sawing or cutting-off machine working by removing metal or cermets.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify CNC control certification and include technical specs in entry docs to confirm numerical control under 8461.50.40
• Provide evidence of metal/cermet removal capability; misclassification as non-CNC risks penalties
• Include end-use statement for semiconductor fab to avoid reclassification to Chapter 84 parts