Mazak Optonics HCG-4020 CNC Laser Cutting Machine from Canada
A numerically controlled laser sawing machine designed for high-precision cutting-off of semiconductor wafers from monocrystalline boules in semiconductor manufacturing. It removes material using a focused laser beam on silicon or gallium arsenide, fitting under HTS 8461.50.40 as a numerically controlled sawing or cutting-off machine working by removing metal or cermets.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify CNC control certification and include technical specs in entry docs to confirm numerical control under 8461.50.40
• Provide evidence of metal/cermet removal capability; misclassification as non-CNC risks penalties
• Include end-use statement for semiconductor fab to avoid reclassification to Chapter 84 parts