8461.50.40/Logitech WA/20 Wafer Slicing Machine/Japan

Logitech WA/20 Wafer Slicing Machine from Japan

Numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. Specifically for crystal growers' output per statistical notes, under HTS 8461.50.40 as NC sawing machine.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Reference statistical note (b)(B) wafer slicing saws in description

• Ensure wire blade specs confirm cermet/metal removal

• File with boule diameter specs for precise classification