Logitech WA/20 Wafer Slicing Machine from Germany
Numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. Specifically for crystal growers' output per statistical notes, under HTS 8461.50.40 as NC sawing machine.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Reference statistical note (b)(B) wafer slicing saws in description
• Ensure wire blade specs confirm cermet/metal removal
• File with boule diameter specs for precise classification