Logitech WA/20 Wafer Slicing Machine from Canada
Numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. Specifically for crystal growers' output per statistical notes, under HTS 8461.50.40 as NC sawing machine.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Reference statistical note (b)(B) wafer slicing saws in description
• Ensure wire blade specs confirm cermet/metal removal
• File with boule diameter specs for precise classification