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8461.50.40/Loadpoint Micro ACE Stealth Dicing Machine/Mexico

Loadpoint Micro ACE Stealth Dicing Machine from Mexico

Ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. Material removal via internal fracture, but structured as NC sawing under HTS 8461.50.40.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document laser mechanism as 'sawing equivalent' for classification

• Include fracture analysis reports for material removal proof