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8461.50.40/Loadpoint Micro ACE Stealth Dicing Machine/Japan

Loadpoint Micro ACE Stealth Dicing Machine from Japan

Ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. Material removal via internal fracture, but structured as NC sawing under HTS 8461.50.40.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document laser mechanism as 'sawing equivalent' for classification

• Include fracture analysis reports for material removal proof