Loadpoint Micro ACE Stealth Dicing Machine from Japan
Ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. Material removal via internal fracture, but structured as NC sawing under HTS 8461.50.40.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document laser mechanism as 'sawing equivalent' for classification
• Include fracture analysis reports for material removal proof