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8461.50.40/Loadpoint Micro ACE Stealth Dicing Machine/Germany

Loadpoint Micro ACE Stealth Dicing Machine from Germany

Ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. Material removal via internal fracture, but structured as NC sawing under HTS 8461.50.40.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Document laser mechanism as 'sawing equivalent' for classification

• Include fracture analysis reports for material removal proof