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8461.50.40/K&S 8800 Turbo Wafer Dicing Saw/Mexico

K&S 8800 Turbo Wafer Dicing Saw from Mexico

High-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. Classified in HTS 8461.50.40 for NC sawing machines used in semiconductor device fabrication.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Provide software screenshots or manuals proving numerical control

• Declare wafer thickness capacity to match statistical note definitions

• Bundle with installation certs to avoid parts classification

K&S 8800 Turbo Wafer Dicing Saw from Mexico — Import Duty Rate | HTS 8461.50.40