K&S 8800 Turbo Wafer Dicing Saw from Japan
High-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. Classified in HTS 8461.50.40 for NC sawing machines used in semiconductor device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide software screenshots or manuals proving numerical control
• Declare wafer thickness capacity to match statistical note definitions
• Bundle with installation certs to avoid parts classification