K&S 8800 Turbo Wafer Dicing Saw from Germany
High-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. Classified in HTS 8461.50.40 for NC sawing machines used in semiconductor device fabrication.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide software screenshots or manuals proving numerical control
• Declare wafer thickness capacity to match statistical note definitions
• Bundle with installation certs to avoid parts classification