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8461.50.40/ESEC 2100 Wafer Sawing Platform/Mexico

ESEC 2100 Wafer Sawing Platform from Mexico

Modular numerically controlled sawing system for semiconductor wafer cutting-off operations. Configurable for different cermet materials, classified HTS 8461.50.40.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Declare full configuration specs