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8461.50.40/ESEC 2100 Wafer Sawing Platform/Japan

ESEC 2100 Wafer Sawing Platform from Japan

Modular numerically controlled sawing system for semiconductor wafer cutting-off operations. Configurable for different cermet materials, classified HTS 8461.50.40.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Declare full configuration specs

ESEC 2100 Wafer Sawing Platform from Japan — Import Duty Rate | HTS 8461.50.40