ESEC 2100 Wafer Sawing Platform from Germany
Modular numerically controlled sawing system for semiconductor wafer cutting-off operations. Configurable for different cermet materials, classified HTS 8461.50.40.
Duty Rate — Germany → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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