ESEC 2100 Wafer Sawing Platform from Germany
Modular numerically controlled sawing system for semiconductor wafer cutting-off operations. Configurable for different cermet materials, classified HTS 8461.50.40.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Declare full configuration specs