DISCO DFD6360 Fully Automatic Dicing Saw from Mexico
Numerically controlled dicing saw for sawing semiconductor wafers into individual chips by removing material along scribe lines. Used in back-end semiconductor processing, classified under HTS 8461.50.40 for its NC control and precise cutting-off function on cermet-like wafer materials.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit machine brochures showing NC programming for wafer dicing to support 8461.50.40 classification
• Label as 'for semiconductor use only' to prevent bulk metal saw misclassification
• Check for dual-use declarations; industrial vs. lab scale may affect duty