DISCO DFD6360 Fully Automatic Dicing Saw from Japan
Numerically controlled dicing saw for sawing semiconductor wafers into individual chips by removing material along scribe lines. Used in back-end semiconductor processing, classified under HTS 8461.50.40 for its NC control and precise cutting-off function on cermet-like wafer materials.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit machine brochures showing NC programming for wafer dicing to support 8461.50.40 classification
• Label as 'for semiconductor use only' to prevent bulk metal saw misclassification
• Check for dual-use declarations; industrial vs. lab scale may affect duty