DISCO DFD6360 Fully Automatic Dicing Saw from Germany
Numerically controlled dicing saw for sawing semiconductor wafers into individual chips by removing material along scribe lines. Used in back-end semiconductor processing, classified under HTS 8461.50.40 for its NC control and precise cutting-off function on cermet-like wafer materials.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit machine brochures showing NC programming for wafer dicing to support 8461.50.40 classification
• Label as 'for semiconductor use only' to prevent bulk metal saw misclassification
• Check for dual-use declarations; industrial vs. lab scale may affect duty