DISCO DFD6360 Fully Automatic Dicing Saw from China
Numerically controlled dicing saw for sawing semiconductor wafers into individual chips by removing material along scribe lines. Used in back-end semiconductor processing, classified under HTS 8461.50.40 for its NC control and precise cutting-off function on cermet-like wafer materials.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Submit machine brochures showing NC programming for wafer dicing to support 8461.50.40 classification
• Label as 'for semiconductor use only' to prevent bulk metal saw misclassification
• Check for dual-use declarations; industrial vs. lab scale may affect duty