Cermet Block Shaping Machine
Machine tool for shaping cermet blocks used in cutting tool inserts by precise metal removal through shaping operations. Under HTS 8461.20.80 as 'other' shaping machines specifically working cermets. Essential for producing indexable inserts for machining industries.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.4% | +35.0% | 39.4% |
| 🇲🇽Mexico | 4.4% | +10.0% | 14.4% |
| 🇨🇦Canada | 4.4% | +10.0% | 14.4% |
| 🇩🇪Germany | 4.4% | +10.0% | 14.4% |
| 🇯🇵Japan | 4.4% | +10.0% | 14.4% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If numerically controlled versions
CNC shaping machines for cermets classify under numerically controlled provisions.
If imported as complete cutting tool production line
Shaping machines integral to tool manufacturing may classify with interchangeable tools.
If for specialized industrial processing
Cermet-specific machines not fitting other tool categories go to residual machinery provisions.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Material safety data sheets for cermet dust handling required for customs and OSHA compliance
• Specify cermet composition (tungsten carbide/cobalt) in technical specs to validate classification
• Coolant system documentation prevents environmental classification issues
Related Products under HTS 8461.20.80
CNC Slotting Machine for Semiconductor Wafers
A precision CNC slotting machine designed to cut narrow slots and grooves into semiconductor wafers during fabrication preparation. It falls under HTS 8461.20.80 as a slotting machine working by removing metal or cermets (such as silicon wafers), specified as 'other' shaping or slotting machines. This equipment ensures exact tolerances critical for wafer processing prior to device fabrication.
Precision Wafer Edge Profiling Slotter
Specialized slotting machine that profiles edges of silicon wafers to exact specifications, removing cermet material for flatness and diameter control. Falls under HTS 8461.20.80 as 'other' slotting equipment for semiconductor preparation processes. Critical for preventing wafer breakage during subsequent fabrication steps.
Automotive Gear Shaping Machine
High-precision gear shaping machine for producing helical and spur gears used in automotive transmissions by progressive tooth cutting. Classified HTS 8461.20.80 as shaping machine 'other' for metal removal gear finishing preparation. Capable of processing gears up to 500mm diameter.
Semiconductor Wafer Crystal Grinder-Slotter
Combined crystal grinder and slotter that grinds semiconductor crystal boules to diameter while slotting flats indicating conductivity type, per statistical note (a)(ii)(A). HTS 8461.20.80 for 'other' slotting/shaping machines working cermets in semiconductor manufacturing. Essential first step after crystal pulling.
Spline Shaft Slotting Machine
Precision slotting machine for cutting involute splines on transmission shafts and PTO components through multiple passes. HTS 8461.20.80 'other' slotting machines for metal removal operations. Used extensively in heavy equipment manufacturing.
Keyway Slotter for Motor Shafts
Compact slotting machine optimized for cutting parallel and Woodruff keyways in electric motor shafts up to 200mm diameter. Falls under HTS 8461.20.80 as specialized 'other' slotting equipment removing metal. High-volume production for appliance and automotive motors.