SiC Boule Flat Cutting Machine SFCM-600 from Japan
Precision slotting/cutting machine for silicon carbide boules used in power electronics, creating flats indicating polytype and doping concentration. High-hardness cermet removal for wide bandgap semiconductor prep per HTS definitions.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify SiC polytype handling (4H/6H); include cutting tool material certifications; verify high-temperature operation specs