Semiconductor Crystal Grinder-Slotter Combo CGS-500 from Japan
Dual-function machine combining grinding and slotting operations for semiconductor boule preparation, streamlining wafer flat creation and diameter control. Statistical notes recognize both grinding flats and diameter as essential wafer prep processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify primary slotting vs grinding function ratios; document throughput capacities; ensure dual-process validation certificates