Precision Crystal Boule Slotter Model CZ-200 from Japan
Automated slotting machine employing Czochralski boule processing to cut orientation flats on silicon ingots for wafer slicing alignment. Removes cermet material to exact resistivity-indicating flat positions per HTS statistical notes. Falls under 8461.20.80.90 as specialized slotting equipment for semiconductor crystal preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include boule processing method certification (Czochralski/float zone); verify cleanroom compatibility ratings; watch for reclassification if adaptable to non-semiconductor metals