Precision Crystal Boule Slotter Model CZ-200 from Japan
Automated slotting machine employing Czochralski boule processing to cut orientation flats on silicon ingots for wafer slicing alignment. Removes cermet material to exact resistivity-indicating flat positions per HTS statistical notes. Falls under 8461.20.80.90 as specialized slotting equipment for semiconductor crystal preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include boule processing method certification (Czochralski/float zone); verify cleanroom compatibility ratings; watch for reclassification if adaptable to non-semiconductor metals