Precision Crystal Boule Slotter Model CZ-200 from Germany
Automated slotting machine employing Czochralski boule processing to cut orientation flats on silicon ingots for wafer slicing alignment. Removes cermet material to exact resistivity-indicating flat positions per HTS statistical notes. Falls under 8461.20.80.90 as specialized slotting equipment for semiconductor crystal preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include boule processing method certification (Czochralski/float zone); verify cleanroom compatibility ratings; watch for reclassification if adaptable to non-semiconductor metals