Gallium Arsenide Wafer Slotting Grinder GS-450 from Japan
High-precision slotting grinder for creating flats on GaAs compound semiconductor boules, essential for wafer alignment in optoelectronic device fabrication. Material removal via diamond tooling on cermet composites meets HTS 8461.20 shaping criteria for semiconductor processing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify GaAs compatibility and flat orientation standards; ensure ESD-safe components certification; provide evidence distinguishing from optical glass processing equipment