Gallium Arsenide Wafer Slotting Grinder GS-450 from China
High-precision slotting grinder for creating flats on GaAs compound semiconductor boules, essential for wafer alignment in optoelectronic device fabrication. Material removal via diamond tooling on cermet composites meets HTS 8461.20 shaping criteria for semiconductor processing equipment.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify GaAs compatibility and flat orientation standards; ensure ESD-safe components certification; provide evidence distinguishing from optical glass processing equipment