Diamond Tip Crystal Flat Broacher DB-150 from Mexico
Broaching machine using diamond tools to cut precise flats on semiconductor boules, ensuring accurate wafer slicing orientation. Though HTS notes emphasize grinding, broaching material removal qualifies under 8461.20 shaping/slotting for semiconductor prep.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond tooling grades and flat tolerances; ensure coolant system compliance; provide semiconductor end-use declaration