8461.20.80.90/Diamond Tip Crystal Flat Broacher DB-150/Japan

Diamond Tip Crystal Flat Broacher DB-150 from Japan

Broaching machine using diamond tools to cut precise flats on semiconductor boules, ensuring accurate wafer slicing orientation. Though HTS notes emphasize grinding, broaching material removal qualifies under 8461.20 shaping/slotting for semiconductor prep.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify diamond tooling grades and flat tolerances; ensure coolant system compliance; provide semiconductor end-use declaration