CNC Slotting Machine for Semiconductor Wafer Flats from Japan
This precision CNC slotting machine grinds flats on monocrystalline semiconductor boules to indicate conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment. It removes material from crystal boules to precise specifications required for semiconductor wafer production. Classified under 8461.20.80.90 as a slotting machine for shaping semiconductor materials by metal/cermet removal.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide technical specs proving semiconductor end-use for potential duty relief under statistical notes; ensure CE marking for electrical safety; declare precise boule diameter compatibility to avoid misclassification as general metalworking equipment