Numerically Controlled Wafer Lapping Machine from Mexico
CNC-controlled lapping equipment that uses abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness. HTS 8460.90.40 applies due to its numerical control and lapping function on metal semiconductor materials.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Document abrasive slurry usage and lapping specs to distinguish from polishing-only machines
• Comply with precision machinery calibration certificates for customs valuation