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8460.90.40/Numerically Controlled Wafer Lapping Machine/Japan

Numerically Controlled Wafer Lapping Machine from Japan

CNC-controlled lapping equipment that uses abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness. HTS 8460.90.40 applies due to its numerical control and lapping function on metal semiconductor materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document abrasive slurry usage and lapping specs to distinguish from polishing-only machines

• Comply with precision machinery calibration certificates for customs valuation

Numerically Controlled Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8460.90.40