Numerically Controlled CNC Wafer Grinder from Mexico
A precision numerically controlled machine tool used for grinding semiconductor wafers to exact dimensional tolerances and surface flatness prior to fabrication. It falls under HTS 8460.90.40 as a grinding machine for metal (silicon wafers) with numerical control, specifically for wafer preparation in semiconductor manufacturing.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Verify numerical control certification and include machine specs in entry docs to confirm HTS 8460.90.40 classification
• Ensure compliance with semiconductor equipment export controls; obtain necessary licenses for dual-use tech