Numerically Controlled CNC Wafer Grinder from China
A precision numerically controlled machine tool used for grinding semiconductor wafers to exact dimensional tolerances and surface flatness prior to fabrication. It falls under HTS 8460.90.40 as a grinding machine for metal (silicon wafers) with numerical control, specifically for wafer preparation in semiconductor manufacturing.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Verify numerical control certification and include machine specs in entry docs to confirm HTS 8460.90.40 classification
• Ensure compliance with semiconductor equipment export controls; obtain necessary licenses for dual-use tech