CNC Precision Deburring Machine for Wafer Carriers from Mexico
Numerically controlled deburring tool that removes burrs from metal wafer carriers and semiconductor handling fixtures using abrasive methods. Classified under HTS 8460.90.40 for metal deburring with numerical control.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Describe deburring abrasives used (stones/brushes) in technical literature submitted
• Link to semiconductor statistical notes in rulings requests if challenged