8460.90.40/CNC Precision Deburring Machine for Wafer Carriers/Japan

CNC Precision Deburring Machine for Wafer Carriers from Japan

Numerically controlled deburring tool that removes burrs from metal wafer carriers and semiconductor handling fixtures using abrasive methods. Classified under HTS 8460.90.40 for metal deburring with numerical control.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Describe deburring abrasives used (stones/brushes) in technical literature submitted

• Link to semiconductor statistical notes in rulings requests if challenged