CNC Semiconductor Wafer Polisher from Japan
Precision numerically controlled polishing machine using abrasive pads/products to finish semiconductor wafer surfaces to mirror quality. Falls under HTS 8460.90.40 as a numerically controlled polishing tool for cermet/metal semiconductor wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include polishing pad/abrasive specifications in entry to confirm 'polishing products' criterion
• Register for semiconductor equipment importer programs for faster clearance
• Avoid misclassification as consumer grinders; specify semiconductor end-use