CNC Semiconductor Wafer Polisher from China
Precision numerically controlled polishing machine using abrasive pads/products to finish semiconductor wafer surfaces to mirror quality. Falls under HTS 8460.90.40 as a numerically controlled polishing tool for cermet/metal semiconductor wafers.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include polishing pad/abrasive specifications in entry to confirm 'polishing products' criterion
• Register for semiconductor equipment importer programs for faster clearance
• Avoid misclassification as consumer grinders; specify semiconductor end-use