CNC Crystal Boule Grinder from Japan
Numerically controlled grinding machine that shapes semiconductor crystal boules to precise diameters and grinds flats indicating conductivity type. Classified in HTS 8460.90.40 for its use of abrasives in metal (silicon/gallium arsenide) finishing during wafer manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide detailed technical drawings showing abrasive grinding mechanism to avoid reclassification
• Label as 'numerically controlled' explicitly; include CNC software details in commercial invoice
• Watch for undervaluation pitfalls; semiconductor equip often scrutinized for fair market value