Precision CNC Lapper for Gallium Arsenide Wafers from Mexico
Advanced numerically controlled lapping system optimized for compound semiconductor wafers like gallium arsenide, using specialized abrasives for flatness finishing. HTS 8460.90.4060 applies as it finishes cermet-like semiconductor materials via lapping/polishing. Used post-slicing for high-performance device substrates.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify material compatibility (GaAs, InP) in technical datasheets for customs review
• Include chemical resistance certifications for slurry-based operations
• Register as semiconductor equipment for potential duty exemptions