Precision CNC Lapper for Gallium Arsenide Wafers from China
Advanced numerically controlled lapping system optimized for compound semiconductor wafers like gallium arsenide, using specialized abrasives for flatness finishing. HTS 8460.90.4060 applies as it finishes cermet-like semiconductor materials via lapping/polishing. Used post-slicing for high-performance device substrates.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify material compatibility (GaAs, InP) in technical datasheets for customs review
• Include chemical resistance certifications for slurry-based operations
• Register as semiconductor equipment for potential duty exemptions