Numerically Controlled Wafer Lapping Machine from Mexico
A precision numerically controlled machine used in semiconductor manufacturing to lap silicon wafers, achieving ultra-flat surfaces within tight tolerances for subsequent fabrication processes. It falls under HTS 8460.90.4060 as a numerically controlled grinding/lapping machine for finishing metal (silicon wafers are metallically processed). Designed specifically for preparing semiconductor wafers from crystal boules.
Duty Rate — Mexico → United States
Rate breakdown
Import Tips
• Verify numerical control features and wafer-specific adaptations in technical specs to confirm classification under 8460.90.4060
• Include detailed end-use documentation proving semiconductor application to avoid reclassification to general machinery
• Ensure vibration isolation and cleanroom compatibility certifications to meet import standards for high-precision tools