8460.90.40.60/Numerically Controlled Wafer Lapping Machine/Japan

Numerically Controlled Wafer Lapping Machine from Japan

A precision numerically controlled machine used in semiconductor manufacturing to lap silicon wafers, achieving ultra-flat surfaces within tight tolerances for subsequent fabrication processes. It falls under HTS 8460.90.4060 as a numerically controlled grinding/lapping machine for finishing metal (silicon wafers are metallically processed). Designed specifically for preparing semiconductor wafers from crystal boules.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Verify numerical control features and wafer-specific adaptations in technical specs to confirm classification under 8460.90.4060

• Include detailed end-use documentation proving semiconductor application to avoid reclassification to general machinery

• Ensure vibration isolation and cleanroom compatibility certifications to meet import standards for high-precision tools