8460.90.40.60/Numerically Controlled Wafer Lapping Machine/China

Numerically Controlled Wafer Lapping Machine from China

A precision numerically controlled machine used in semiconductor manufacturing to lap silicon wafers, achieving ultra-flat surfaces within tight tolerances for subsequent fabrication processes. It falls under HTS 8460.90.4060 as a numerically controlled grinding/lapping machine for finishing metal (silicon wafers are metallically processed). Designed specifically for preparing semiconductor wafers from crystal boules.

Duty Rate — China → United States

39.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Verify numerical control features and wafer-specific adaptations in technical specs to confirm classification under 8460.90.4060

• Include detailed end-use documentation proving semiconductor application to avoid reclassification to general machinery

• Ensure vibration isolation and cleanroom compatibility certifications to meet import standards for high-precision tools