Numerically Controlled Wafer Grinder for Crystal Boules from Mexico
CNC grinder designed to precision-grind semiconductor crystal boules to exact diameters and flats indicating conductivity type, as per statistical notes for wafer preparation. Falls under HTS 8460.90.4060 as a numerically controlled machine for grinding metal (silicon) using abrasives. Essential step before slicing wafers from monocrystalline boules.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include boule diameter specs and flat-grinding documentation matching statistical note descriptions
• Avoid misdeclaration as general metal grinders by specifying semiconductor end-use
• Calibrate and certify spindle accuracy before shipment to prevent inspection delays