Numerically Controlled Wafer Grinder for Crystal Boules from Japan
CNC grinder designed to precision-grind semiconductor crystal boules to exact diameters and flats indicating conductivity type, as per statistical notes for wafer preparation. Falls under HTS 8460.90.4060 as a numerically controlled machine for grinding metal (silicon) using abrasives. Essential step before slicing wafers from monocrystalline boules.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include boule diameter specs and flat-grinding documentation matching statistical note descriptions
• Avoid misdeclaration as general metal grinders by specifying semiconductor end-use
• Calibrate and certify spindle accuracy before shipment to prevent inspection delays