Numerically Controlled Wafer Grinder for Crystal Boules from China
CNC grinder designed to precision-grind semiconductor crystal boules to exact diameters and flats indicating conductivity type, as per statistical notes for wafer preparation. Falls under HTS 8460.90.4060 as a numerically controlled machine for grinding metal (silicon) using abrasives. Essential step before slicing wafers from monocrystalline boules.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include boule diameter specs and flat-grinding documentation matching statistical note descriptions
• Avoid misdeclaration as general metal grinders by specifying semiconductor end-use
• Calibrate and certify spindle accuracy before shipment to prevent inspection delays