Numerically Controlled Double-Sided Wafer Polisher from Mexico
CNC machine that simultaneously polishes both sides of semiconductor wafers using abrasive pads and slurries for mirror-like surface finish. Falls under HTS 8460.90.4060 as a numerically controlled polishing tool for metal wafer finishing. Key for achieving total thickness variation specs in wafer production.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Demonstrate simultaneous polishing capability with process videos or engineering drawings
• Specify TTV (total thickness variation) removal rates for classification support
• Include carrier plate and retaining ring specs as integral components