Numerically Controlled Double-Sided Wafer Polisher from Japan
CNC machine that simultaneously polishes both sides of semiconductor wafers using abrasive pads and slurries for mirror-like surface finish. Falls under HTS 8460.90.4060 as a numerically controlled polishing tool for metal wafer finishing. Key for achieving total thickness variation specs in wafer production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Demonstrate simultaneous polishing capability with process videos or engineering drawings
• Specify TTV (total thickness variation) removal rates for classification support
• Include carrier plate and retaining ring specs as integral components