CNC Semiconductor Wafer Edge Profiling Machine from Canada
Numerically controlled abrasive machine for profiling and chamfering wafer edges to prevent chipping during handling and processing in semiconductor fabs. Classified under HTS 8460.90.4060 for its grinding/finishing of metal wafers using polishing products. Improves yield in wafer manufacturing workflow.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document edge chamfer angles and profile specs to validate semiconductor-specific design
• Pair with wafer handling system declarations if imported as a unit
• Test for particulate generation to meet cleanroom import requirements