Entry Wafer Grinder-Polisher Combo
Dual-function low-cost machine for grinding and polishing wafers.
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Related Products under HTS 8460.40.80.20
Benchtop Wafer Lapping Machine
A compact machine designed for precision lapping of semiconductor wafers to achieve exact flatness tolerances prior to fabrication processes. It falls under HTS 8460.40.80.20 as a lapping machine for finishing metal or cermets (silicon wafers qualify as cermet-like materials in semiconductor context), valued under $3,025 each. Used in wafer preparation equipment per statistical notes.
Manual Crystal Wafer Grinder
Hand-operated grinder for processing semiconductor crystal boules to precise diameters, creating flats for conductivity indication as per statistical notes. Classified under HTS 8460.40.80.20 for grinding machines finishing metal/cermets, low-value. Essential in wafer preparation workflow.
Portable Semiconductor Wafer Polisher
Lightweight polisher for final surface finishing of silicon wafers, achieving mirror-like flatness for device fabrication. HTS 8460.40.80.20 applies to low-value polishing machines using abrasives on cermet-like semiconductor materials. Aligns with statistical note for wafer grinders, lappers, polishers.
Tabletop Honing Machine for Cermet Parts
Small honing machine for finishing cermet components used in semiconductor processing tools, using abrasive stones. Fits HTS 8460.40.80.20 as other low-value honing machines for metal/cermets. Supports precision finishing in high-tech manufacturing.
Entry-Level Wafer Edge Grinder
Budget grinder for chamfering and edge finishing of semiconductor wafers to prevent chipping during handling. Under HTS 8460.40.80.20 for low-value grinding machines finishing silicon (cermet equivalent). Part of wafer preparation per statistical notes.
Compact Lapping Plate Polisher
Machine with lapping plates for simultaneous polishing of multiple small semiconductor wafers or cermet substrates. HTS 8460.40.80.20 for low-value lapping/polishing equipment using abrasives on metals/cermets.