8460.39.00.50/Wafer Edge Grinder for Semiconductor Crystal Boules/Japan

Wafer Edge Grinder for Semiconductor Crystal Boules from Japan

Specialized grinder for precise edge profiling and deburring silicon wafer edges post-slicing from monocrystalline boules. HTS 8460.39.0050 covers this as a tool grinding machine for semiconductor processing per statistical notes on wafer preparation. Critical for flatness in chip fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Reference statistical note (a)(ii) in entry docs to justify semiconductor classification

• Include cleanroom compatibility certs and material safety data for silicon handling